Keysight Technologies, Inc. has joined the TSMC Open Innovation Platform® (OIP) 3DFabric Alliance, which was recently established by TSMC to speed up the innovation and preparedness of the 3D integrated circuit (IC) ecosystem. The Alliance's main goal is to quickly deploy system- and silicon-level improvements that support mobile and next-generation compute applications leveraging TSMC's 3DFabric technologies.

 

Keysight's membership in the 3DFabric Alliance grants it access to the TSMC 3DbloxTM standard, enabling the creation of testing and electronic design automation (EDA) tools. In order to speed up the development of 3D IC designs, Keysight will gain access to 3DFabric technology to improve its design tools and workflows. Additionally, Keysight and TSMC will work together on test and measurement methodologies to guarantee the excellence and dependability of 3D IC designs.

 

To address the growing complexity of 3D IC design, Keysight will also take part in TSMC's 3Dblox standardisation initiative. The 3Dblox standard integrates qualified EDA tools and workflows into the design environment. This modularized standard describes the essential physical stacking and logical connectivity data in a single format for 3D IC designs.

 

Dan Kochpatcharin, Head of the Design Infrastructure Management Division at TSMC, said: “TSMC works closely with our 3DFabric Alliance partners to offer customers an easy and flexible way to unlock the power of 3D IC in their designs. The addition of Keysight to the 3DFabric Alliance will add unique design and test expertise to our growing 3D semiconductor community. Through the 3DFabric Alliance, TSMC and Keysight will collaborate to deliver high-quality design and test solutions and services to help customers achieve speedy implementation of system-level innovations and quickly launch their differentiated 3D IC products to market.”

 

Nilesh Kamdar, Senior Director, Portfolio Manager at Keysight, said: “TSMC is blazing the trail for 3D IC design technologies and workflows. Becoming a member of 3DFabric Alliance brings our expertise in high speed, high frequency design, and test to the 3D semiconductor community. Keysight’s simulation and test tools are well-suited to ensure first pass success of 3D ICs in TSMC’s technologies for customers innovating future mobile applications.”